ARQUIMEA has demonstrated BrainChip’s Akida with a Prophesee event-based Metavision® camera on a low-power drone to detect ...

The introduction of LPDDR5 in 2019 marked a major leap, delivering up to 6400Mbps and adding features like in-line ECC for ...

Creonic, the leading provider of high-performance IP cores for ASIC and FPGA technologies, has unveiled a bold new brand ...

Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features such as higher bandwidth, power ...

Siemens Digital Industries Software today announced that Secafy has adopted Siemens’ full IC design flow consisting of its ...

VeriSilicon’s GCNano3DVG IP combines optimized hardware pipelines with a lightweight and configurable software stack to ...

Andes Technology, the global leader in RISC-V processor IP, celebrates its 20th anniversary by unveiling a refreshed logo and announcing the upcoming opening of its new headquarters.

European and Japanese suppliers of semiconductor equipment are set to be targeted in the next round of tariffs by the US.

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and ...

Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node ...

The ODT-PVT-ULP-001C-3 provides simple and seamless integration, requiring just a single core-voltage supply and a digital ...

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), provides an overview of the ...