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10h
Nvidia, TSMC, and advanced packaging realignment in 2025
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
New Electronics
7h
TSMC set to build two additional CoWoS facilities
TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).
4h
RTX 5090 early benchmarks show underwhelming performance uplift over the RTX 4090
The RTX 5090 was put through its paces in Geekbench 5, where it notched up impressive scores in both the OpenCL and Vulkan tests (via BenchLeaks).
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