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Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...
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Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersUse precise geolocation data and actively scan device characteristics for identification. This is done to store and access ...
SK Hynix Inc., the world’s second-largest memory chipmaker, reported a dramatic surge in first-quarter profits on Thursday, delivering the second-highest quarterly earnings in its history, driven by ...
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